Isoconversional analysis of copper recrystallization

An incremental isoconversional method for kinetic analysis

The recrystallization of copper single crystals deformed at 4.2 K

The deformation of copper single crystals at 4.2 K occurs by a sequence of slip, twinning and slip in the twinned structure. Subsequent annealing of the deformed structures obtained at various points at this sequence of deformation permits the detailed nature of the deformed and recrystallized states to be related in a unique fashion. Material recrystallized from structures obtained prior to th...

Primary Recrystallization and Grain Growth of Tough Pitch Copper Wire

Tough pitch copper wire (99.97% Cu) is generally characterized by the spiral elongation number. The principle of the test is based on the influence of impurities on the recrystallization kinetics. Alternative non-metallographic techniques to characterize the recrystallization kinetics have been investigated in this study, such as differential scanning calorimetry (D.S.C.) and residual electrica...

Kinetics of individual grains during recrystallization of cold-rolled copper

The formation of a recrystallization texture is closely related to the nucleation and growth of recrystallizing grains, which may vary from grain to grain. Cube texture is a commonly observed recrystallization texture in face centered cubic metals of medium to high stacking fault energy after heavy cold-rolling and annealing. In this work, recrystallization of pure copper cold-rolled to a von M...

Investigation of Recrystallization and Grain Growth of Copper and Gold Bonding Wires

Copper bonding wires were characterized using electron backscatter diffraction (EBSD). During drawing, shear components are mainly located under the surface and ,111. and ,100. fiber texture components develop with similar volume fractions. Grain average misorientation (GAM) and scalar orientation spread (SOS) of the ,100. component are lower than those of the ,111. or other orientations. Also,...